BOSCHMAN TECHNOLOGIES
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: Smartcards and discrete packages MEMS and sensor packages Leadless and substrate-based packages Special application packages We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.
BOSCHMAN TECHNOLOGIES
Industry:
Consumer Packaging Services Semiconductor
Founded:
1987-01-01
Address:
Duiven, Gelderland, The Netherlands
Country:
The Netherlands
Website Url:
http://www.boschman.nl
Total Employee:
1+
Status:
Active
Contact:
+31 263 194 900
Email Addresses:
[email protected]
Total Funding:
0
Technology used in webpage:
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Investors List
Holland Capital
Holland Capital investment in Private Equity Round - Boschman Technologies
Official Site Inspections
http://www.boschman.nl
- Host name: s18.mijnwebsitehosting.nl
- IP address: 5.255.79.21
- Location: Netherlands
- Latitude: 52.3824
- Longitude: 4.8995
- Timezone: Europe/Amsterdam
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