CU-TECH
Cu-Tech is a full-service contract clinical research organization (CRO), is uniquely specialized in the development of products related to dermatologic disease, and skin care. Cu-Tech are pleased to offer our clients over a decade of experience in providing superior clinical research service to the pharmaceutical industry.
CU-TECH
Social Links:
Industry:
Biotechnology Pharmaceutical
Address:
Mountain Lakes, New Jersey, United States
Country:
United States
Website Url:
http://www.cu-tech.com
Status:
Active
Contact:
(973) 331-1620
Technology used in webpage:
SPF Nginx Microsoft Exchange Online Office 365 Mail Microsoft Azure DNS AJAX Libraries API GoDaddy DNS Proofpoint GoDaddy Premium DNS Bizland
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Official Site Inspections
http://www.cu-tech.com
- Host name: 65-254-227-224.yourhostingaccount.com
- IP address: 65.254.227.224
- Location: Burlington United States
- Latitude: 42.509
- Longitude: -71.1984
- Metro Code: 506
- Timezone: America/New_York
- Postal: 01803
More informations about "Cu-Tech"
CU TECH CORPORATION Company Profile - Dun & Bradstreet
Find company research, competitor information, contact details & financial data for CU TECH CORPORATION of Pyeongtaek, Gyeonggi. Get the latest business insights from Dun & …See details»
Company CU-Tech Corporation - MarketScreener.com
Jan 31, 2012 Cu Tech Corp is a Korea-based company principally engaged in the printed circuit boards manufacturing business. The Company mainly manufacture and sale drive boards of …See details»
Elimination of Cu Precipitation in Al-Cu films due to the Effect of ...
This paper explains how copper precipitation can be eliminated for metal-insulator-metal (MIM) dielectric capacitor processes for technology nodes larger than 0.13um with annealing at the …See details»
Development of Cu etch process for advanced Cu interconnects
Recent development efforts in copper etch processing show promising results in many areas that have posed significant challenges for this new technology. We report on etch performance for …See details»
Dry etching of copper thin films in high density plasma of …
Feb 28, 2019 The plausible etch products would be Cu(OH) 2 and/or Cu(CH 3 COO) 2. The systematic etching studies were carried out by varying coil rf power, dc-bias voltage to …See details»
Achieving Sub-nm Copper Recess Controllability for Advanced 3D ...
For the next generation memory devices such as 3D-NAND involving copper-to-copper (C2C) hybrid bonding process, chemical mechanical planarization (CMP) process is a vital step to …See details»
Chemical Etching and Patterning of Copper, Silver, and …
Oct 29, 2014 For instance, removal of copper in the +2 oxidation state (cupric or Cu 2+) occurs readily using hafcH without oxidant (e.g., H 2 O 2) addition. 31 However, Cu metal (Cu 0) was not etched, while exposure of Cu +1 (e.g., Cu …See details»
CU-Tech Corporation Stock - MarketScreener.com
Nov 22, 2024 CU-Tech Corporation Reports Earnings Results for the Full Year Ended December 31, 2022 23-03-21: CI CU-Tech Corporation has completed an IPO in the amount …See details»
Significant Improvement of Copper Dry Etching …
Feb 27, 2019 The characteristics of copper (Cu) isotropic dry etching using a hydrogen-based plasma generated at 13.3 kPa (100 Torr) were improved dramatically by simply introducing a moderate amount of N2 gas into the …See details»
Optimization of Cupric Chloride Subtractive Etching for Cu High …
Oct 1, 2018 Abstract. The continuously increasing demand for innovation in the miniaturization of microelectronics has driven the need for ever more precise fabrication strategies for device …See details»
A novel integration scheme for self-aligend Ru topvia as post-Cu ...
A novel integration process for self-aligned topvia Ru interconnects has been demonstrated, where lines are patterned through a subtractive scheme and vias are formed through a …See details»
Significant Improvement of Copper Dry Etching Property of a High ...
The Cu etch rate increased with increasing input power. The maximum etch rate reached 3.1 μm/min at an input power of 100 W and a C H 2 of 0.9. The surface roughness of the etched …See details»
Efficient CO2 electroreduction on facet-selective copper films with ...
Sep 30, 2021 Here the authors describe a deposition-etch-bombardment synthetic approach to prepare Cu(100)-rich thin film electrodes for CO2 electroreduction with over 50% ethylene …See details»
Review of Etchants for Copper and its Alloys in Wet
Dec 6, 2007 It affects etch rate and surface finish quality. Copper and its alloys are important commercial materials in various industries, especially in electronics industry.See details»
Direct etched Cu characterization for advanced interconnects
Cu wires patterning by direct etch methods is investigated at 300mm wafer level. Cross-sectional sidewall profiles with tapering angles around 74.5° are obtained with a mid-line width of 44 nm, …See details»
Copper dry etching by sub-atmospheric-pressure pure hydrogen …
Nov 23, 2016 The Cu etching rate is 10 times higher than that of SiO 2, which implies that this etching technique has potential applications for Cu wiring on an SiO 2 layer. The Cu surface …See details»
Communication—Electrochemical Atomic Layer Etching of Copper
May 9, 2018 Atomic layer etching (ALE) processes are critically important for the precise tailoring of materials and structures in nano-electronics. 1 For atomically precise etching of …See details»
Sn-Ag Compatible Selective Ti Etch in Cu RDL Fabrication and 3D …
Abstract: Selective Titanium (Ti) etch chemistries have been developed to provide enabling Ti removal up to $0.2\mu \mathrm{m}$ thickness with good Cu, Sn-Ag and TEOS compatibility. …See details»
CU Denver’s new chancellor has engineering background and a …
1 day ago CU Denver has 1,900 employees and an annual economic impact to the state of $684 million. The national search for a CU Denver chancellor launched in August 2024. You care.See details»
Relationship Between Wafer-Level Warpage and Cu ... - IEEE Xplore
Sep 6, 2013 In this paper, we developed an isotropic wet etching process in a capsule-type bevel etch chamber to reduce a Cu overburden of through Si via (TSV) for less wafer-level …See details»