Corporate History
- Mar-
- Received two invention patents for "Printed circuit board protective film and surface mount process for printed circuit board using the same", and "Silica gel board used for circuit board compressing and compressing method using the board".
- Jul-
- Exercised surplus and employee bonus transferred to capital increase NTD71,469,000; paid-in capital increased to NTD652,259,000.
- Aug-
- In order to tie in the initial OTC public underwrtinting, AEM processed capital increase in cash and issued 6,700,000 ordinary shares, par value NTD 10, for a total of NTD 67,000,000, paid-in capital after capital increase is NTD719,259,000.
- Sept-
- Company's stocks were approved, GreTai Verify No. 1000024918, by ROC GreTai Securities Market on 16th September 201, OTC trading began on 19th September 2011, and emerging tradng was terminated on the same day.
- Feb-
- Received two new patents for "Protective film for rigid-flex printed circuit board" and "Cover layer for printed circuit board".
- Mar-
- AEM was approved for make-up public issuing.
- Apr-
- Received three new patents for "Coverlay and printed circuit board structure use the same", "Composite double-sided copper foil substrates and flexible printed circuit board structures using the same", and "Coverlay with thermal conductivity".
- May-
- Received the new patent for "Polyimide composite film for printed circuit board".
AEM was approved for emerging trading registry on May 2010; stock code 4939.
- Aug-
- Received the new patent for "Copper clad laminate for flexible printed circuit board".
- Sept-
- Exercised surplus and employee bonus transferred to capital increase NTD35,790,000; paid-in capital increased to NTD580,790,000.
- Oct-
- Received the invention patent for "Composites comprising nano-inorganic particles with the organically functional group applied in the manufactures of polyimide film and two-layered flexible copper clad substrate".
- Dec-
- AEM Kunshan, subsidiary in China, received Chinese high-tech enterprise certification.
- Feb-
- Received the new patent for "Polyimide Composite Film Structure".
- Aug-
- Received the new patent for "Double-sided Copper Foil Substrates Structure".
- Oct-
- Received five new patents for " Extinction spectra polymer thin film structure", "Copper clad modification device", "Polyimide composite thin film and stiffener for printed circuit board", "Flexible printed circuit board structure" and "Coverlay for printed circuit board".
- Nov-
- Received two new patents for "Thin film modification device" and "Copper clad laminate for flexible print circuit board".
- Jan-
- Received 2007 Best Supplier Award from Career Technology Co., Ltd.
- Feb-
- Passed SONY Japan GREEN PARTNER certification.
- Jul-
- Exercised surplus transferred to capital increase NTD15 million; paid-in capital increased to NTD545 million.
- Nov-
- Received the new patent for "Coverlay for manufacturing printed circuit board, flexible printed circuit board and printed circuit board lamination structure".
- Jan-
- Received 2006 Best Supplier Award from Career Technology Co., Ltd.
- Jul-
- Passed QC080000 Certification.
- Oct-
- Excised cash capital increase NTD 30 million; paid-in capital increased to NTD530 million.
The third production line of AEM Kunshan (China) began full-scale production.
- Dec-
- AEM Kunshan (China) passed Kunshan Technology R& D Center certification.
- Apr-
- AEM Kunshan (China) officially introduced GP/ROHS product environment/quality management system.
Excised cash capital increase NTD 30 million; paid-in capital increased to NTD440 million
- Aug-
- AEM Kunshan (China) began full-scale production for 2-Layer non-adhesive single-side FCCL.
AEM Kunshan (China) passed ISO 14001 environment management system certification.
- Dec-
- Excised cash capital increase NTD 60 million; paid-in capital increased to NTD500 million.
- Sept-
- Excised cash capital increase NTD 49,250,000; paid-in capital increased to NTD410 million.
- Feb-
- Excised cash capital increase NTD 65million; paid-in capital increased to NTD285 million.
- May-
- First production line of AEM Kunshan (China) began pilot run.
Excised cash capital increase NTD 40 million; paid-in capital increased to NTD325 million.
- Jun-
- First production line of AEM Kunshan (China) began full-scale production.
Exercised cash capital increase NTD 35,750,000; paid-in capital increased to NTD360,750,000.
AEM Kunshan (China) passed U/L certification (File No. E246440 Website:www.UL-asia.com).
- Jul-
- Passed ISO9001 Certification.
- Aug-
- AEM Kunshan (China) began full-scale production for 3-Layer adhesive single-sided and double-sided FCCL.
- Oct-
- AEM Kunshan (China) began full-scale production for 3-Layer adhesive single-sided and double-sided FCCL.
- Jul-
- Asia Electronic Materials Co., Ltd. (AEM) was founded to manufacture coverlay and flexible copper clad laminate etc., and market flexible circuit board substrate; registered capital is NTD1million. R&D Center was set up at the Incubation Center of ITRI. The Investment Commission approved indirect investment in AEM Kunshan in China via a third country.
- Aug-
- Excised cash capital increase NTD 34,490,000; paid-in capital increased to NTD35,490,000.
- Oct-
- Excised cash capital increase NTD 115,210,000; paid-in capital increased to NTD150,700,000.
- Dec-
- Exercised cash capital increase NTD 69,300,000; paid-in capital increased to NTD220 million.