TONGXIN MICRO (TMC) debuts at 7th BMIC showcased a series of identity verification solutions featuring high security, high reliability, high performance and multi-application, while its world-leading security chip technology became the center of attention at thevenue.
TONGXIN MICRO
Semiconductor Manufacturing
Beijing, Beijing 253 followers
THE LIGHT OF SCIENCE AND TECHNOLOGY BRIGHTENS HUMAN LIFE
About us
Being a key player of automotive electronics and smart chip in Tsinghua Unigroup, Tongxin Microelectronics Co., Ltd. (TMC) was founded in 2001 by the R&D team of the national ID card chip project from the Institute of Microelectronics of Tsinghua University. TMC has undertaken several significant national industrial projects, including the second-generation ID chip, the e-ticket system for the 2008 Beijing Olympic Games, dual-interface financial chips with high capacity & security level, and automotive-grade MCUs. It specializes in the fields of automotive electronics and security chips, with a cumulative shipment exceeding 23 billion chips, providing products and services to over twenty countries and regions across Asia, Europe, the Americas, and Africa. With more than 20 years of continuous innovation and breakthroughs, we have accumulated industry-leading chip R&D technologies and wafer testing capabilities, as evidenced by awards and certifications such as the First Prize of National Science and Technology Progress Award, CC EAL6+, GSMA SAS-UP, AEC-Q100 Grade1 and ISO 26262 ASIL D. We have become an industry-leading provider of chips and solutions.
- Website
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http://www.tsinghuaic.com/
External link for TONGXIN MICRO
- Industry
- Semiconductor Manufacturing
- Company size
- 501-1,000 employees
- Headquarters
- Beijing, Beijing
- Type
- Public Company
- Founded
- 2001
Locations
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Primary
Get directions
F/1, Building B-1, Zhongguancun Dongsheng Technology Park Northern Territory, No.66 Xixiaokou Road, Haidian District
Beijing, Beijing 100083, CN
Employees at TONGXIN MICRO
Updates
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On August 22nd 2024 TMC Partner Conference Innovative Applications of Security Chips Forum concluded successfully in Beijing. With the theme of "Smart Chip Ecology, Interconnected Chip Security," this forum focused on financial payment, electronic documents security identification, and mobile communication fields, gathering top enterprises in the industry chain. #2024 TMC Partner Conference
Scale Heights of Security Chips!2024 TMC Partner Conference: Innovative Applications of Security Chips Forum Concludes Successfully
TONGXIN MICRO on LinkedIn
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🚀 TMC's Path to Enhanced Device Performance: Simlessly Streamlines eSIM Testing!
🚀 TMC's Path to Enhanced Device Performance: Simlessly Streamlines eSIM Testing! Discover how TONGXIN MICRO, a leading player in automotive electronics and smart chips, partnered with Simlessly to revolutionize their eSIM testing process. From RF & Conformance tests to real network testing, our collaboration has enabled TMC to streamline workflows, save time and costs, and enhance device performance. Key Highlights: - Remote and flexible eSIM configuration - Automated and digitized testing framework - Seamless API integration - Support for multiple test scenarios and teams Learn more about our successful partnership and how Simlessly's innovative solutions can help your business achieve similar results. 🔗 Read the full success story here: https://lnkd.in/ghc44wGb #eSIM #Integration #API #eSIMTesting #RSP #RSPaaS #Innovation #SuccessStory #Simlessly
Simlessly
simlessly.com
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#SeamlessLaunchPad,Hengbo Sun of Product Manager Tongxin Micro delivered the speech on "eSIM, enable global payments to be accessible ”.
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#SeamlessLaunchPad， Ye Li of Sales Manager Tongxin Micro delivered the speech on "Secure IC Solution for Payment and Battery Traceability”.
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