PAC TECH - PACKAGING TECHNOLOGIES
Pac Tech GmbH equipment offers semiconductor manufacturers several distinct advantages over other conventional methods. There is virtually no damage to substrates using their patented contactless method of applying solder-balls to fine and thin materials such as those used in hard disk drive head applications. The electroless wafer bumping method has a strong advantage in achieving short lead-time and low-cost compared to existing electroplating methods. As semiconductor geometries become smaller and smaller, the need for very fine-pitch solder-ball placement and wafer level packaging will become even more critical.
PAC TECH - PACKAGING TECHNOLOGIES
Social Links:
Industry:
Machinery Manufacturing Semiconductor
Founded:
1995-01-01
Address:
Nauen, Brandenburg, Germany
Country:
Germany
Website Url:
http://www.pactech.com
Total Employee:
11+
Status:
Active
Contact:
+49033214495100
Email Addresses:
[email protected]
Technology used in webpage:
Viewport Meta IPhone / Mobile Compatible SPF SSL By Default Google Font API LetsEncrypt Apple Mobile Web Clips Icon Google Tag Manager WordPress Content Delivery Network
Official Site Inspections
http://www.pactech.com Semrush global rank: 3.77 M Semrush visits lastest month: 3.58 K
- Host name: 217-160-0-72.elastic-ssl.ui-r.com
- IP address: 217.160.0.72
- Location: Germany
- Latitude: 51.2993
- Longitude: 9.491
- Timezone: Europe/Berlin
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